The mobile world can collectively let off a sigh of relief. Qualcomm has apparently fixed the overheating issues with their Snapdragon 810 chipset, if reports are to be believed.
Sure, the company never officially confirmed that these problems actually existed in the first place.
But this report cites a Chinese analyst with links to the foundry where the mobile processor is being manufactured with claims that the company has managed to iron out these issues — and just in the nick of time too.
With the 2015 edition of the Mobile World Congress about to get underway in Barcelona next month, these chips are expected to power several premium flagship handsets.
The analyst further reveals that production for the chip will be sped up, to ensure that it is ready for sale by March. However, considering that these are unconfirmed reports for now, it is perhaps best to take them with a grain of salt.
Qualcomm, of course, recently confirmed that the Snapdragon 810 will power future Windows Phone flagships, from Microsoft and friends, later this year.
This premium chipset is expected to power the unannounced HTC One M9, both the Android and Windows 10 for Phones variant. And Microsoft is sure to use this processor for some of its newer Lumia smartphones in the fall.